This Event is the first meeting to introduce the IEEE Student Branch at Ontario Tech University to first and second year undergraduate students at Ontario Tech University. Room: 1350, Bldg: SIRC, 2000 Simcoe Street N, Oshawa, Ontario, Canada, L1G0C5

Silicon photonics are the semiconductor integration of EIC and PIC on a silicon substrate (wafer) with complementary metal-oxide semiconductor (CMOS) technology. On the other hand, co-packaged optics (CPO) are heterogeneous integration packaging methods to integrate the optical engine (OE) which consists of photonic ICs (PIC) and the electrical engine (EE) which consists of the electronic ICs (EIC) as well as the switch ASIC (application specific IC). The advantages of CPO are: (a) to reduce the length of the electrical interface between the OE/EE (or PIC/EIC) and the ASIC, (b) to reduce the energy required to drive the signal, and (c) to cut the latency which leads to better electrical performance. In the next few years, we will see more implementations of a higher level of heterogeneous integration of PIC and EIC, whether it is for performance, form factor, power consumption or cost. Speaker(s): John H Lau, Agenda: The content of this lecture is shown below. - Silicon Photonics - Data Centers - Optical Transceivers - Optical Engine (OE) and Electrical Engine (EE) - OBO (on-board optics) - NPO (near-board optics) - CPO (co-packaged optics) - Integration of the PIC and EIC - 2D Heterogeneous Integration of PIC and EIC - 2D Heterogeneous Integration of ASIC Switch, PIC and EIC - 2D Heterogeneous Integration of ASIC Switch, PIC and EIC with Bridges - 3D Heterogeneous Integration of PIC and EIC - 3D Heterogeneous Integration of ASIC Switch, PIC and EIC - 3D Heterogeneous Integration of ASIC Switch, PIC and EIC with Bridges - Heterogeneous Integration of ASIC Switch, PIC and EIC on Glass Substrate - Summary Room: HA 401, Bldg: Haultain Building, 170 College St, Toronto, Ontario, Canada, M5S 3E3, Virtual: https://events.vtools.ieee.org/m/436266

BBA Consultants and IEEE Toronto Section in collaboration with IEEE Canada Educational Activities Committee cordially invite you to an engaging and informative session on Modern Electrical Systems with a focus on the IEC-61850 standard, a pivotal component in modern electrical systems. This technical event will delve into the intricacies of IEC-61850, its significance in enabling seamless communication and interoperability within electrical substations, and its role in shaping the future of power systems. Join us for insightful presentations and discussions led by Sanaz Kanani who will share her knowledge and experience on this vital standard and its impact on modern electrical systems. Whether you're an engineer, technician, or simply interested in the latest advancements in electrical systems, this event promises valuable insights into the world of IEC-61850 and its role in shaping the future of power systems. This is a hybrid event for both in-person and online participation. Co-sponsored by: BBA Consultants Speaker(s): Sanaz Kanani Agenda: - Welcome & Introduction - Safety moment - Evolution of technologies - Digital substation Fundamentals and Overview - Standard Overview - Understanding the basics and importance of IEC-61850. - Practical Applications - Real-world examples and case studies - Q&A Session - Open discussion and queries Room: ENG460, Bldg: TUM, George Vari Engineering and Computing Building, 245 Church Street, Toronto, Ontario, Canada, M5B1Z4, Virtual: https://events.vtools.ieee.org/m/434559