This Event is the first meeting to introduce the IEEE Student Branch at Ontario Tech University to first and second year undergraduate students at Ontario Tech University. Room: 1350, Bldg: SIRC, 2000 Simcoe Street N, Oshawa, Ontario, Canada, L1G0C5

Silicon photonics are the semiconductor integration of EIC and PIC on a silicon substrate (wafer) with complementary metal-oxide semiconductor (CMOS) technology. On the other hand, co-packaged optics (CPO) are heterogeneous integration packaging methods to integrate the optical engine (OE) which consists of photonic ICs (PIC) and the electrical engine (EE) which consists of the electronic ICs (EIC) as well as the switch ASIC (application specific IC). The advantages of CPO are: (a) to reduce the length of the electrical interface between the OE/EE (or PIC/EIC) and the ASIC, (b) to reduce the energy required to drive the signal, and (c) to cut the latency which leads to better electrical performance. In the next few years, we will see more implementations of a higher level of heterogeneous integration of PIC and EIC, whether it is for performance, form factor, power consumption or cost. Speaker(s): John H Lau, Agenda: The content of this lecture is shown below. - Silicon Photonics - Data Centers - Optical Transceivers - Optical Engine (OE) and Electrical Engine (EE) - OBO (on-board optics) - NPO (near-board optics) - CPO (co-packaged optics) - Integration of the PIC and EIC - 2D Heterogeneous Integration of PIC and EIC - 2D Heterogeneous Integration of ASIC Switch, PIC and EIC - 2D Heterogeneous Integration of ASIC Switch, PIC and EIC with Bridges - 3D Heterogeneous Integration of PIC and EIC - 3D Heterogeneous Integration of ASIC Switch, PIC and EIC - 3D Heterogeneous Integration of ASIC Switch, PIC and EIC with Bridges - Heterogeneous Integration of ASIC Switch, PIC and EIC on Glass Substrate - Summary Room: HA 401, Bldg: Haultain Building, 170 College St, Toronto, Ontario, Canada, M5S 3E3, Virtual: https://events.vtools.ieee.org/m/436266

[] Join us this October 1st from 4 PM to 6 PM at Room A3-43, Progress Campus, as the IEEE Centennial College Student Branch hosts an exciting celebration of IEEE Day. This event is open to all engineering students and promises to be a great opportunity to network, learn, and enjoy some free food! What’s Happening? IEEE Day celebrates the first time in history when engineers worldwide gathered to share their technical ideas in 1884. Continuing the tradition, our student branch is bringing together bright minds to foster technological innovation and excellence for the benefit of humanity. Here's what you can expect: - Networking Opportunities: Meet other engineering students and professionals, expand your network, and discuss opportunities in the field. - Free Food: Enjoy complimentary pizza and drinks while they last – come early! - Fun Activities: Engage in discussions and activities centered around engineering and technology. Why You Should Attend This is more than just a social event; it’s a platform to inspire and be inspired. You'll get to interact with peers and seniors in a casual setting, making it the perfect backdrop to exchange ideas and foster new friendships. Plus, who can say no to free pizza? How to Register To ensure we have enough food and drinks for everyone, please register for the event by scanning the QR code on the posters around campus or by visiting our (https://forms.gle/7hcx3wU4GLAV9gox8). Join Us! We can't wait to see you there and celebrate the incredible world of engineering together. Mark your calendar for October 1st, and bring a friend along. Let’s make IEEE Day 2023 a memorable one! Room: A3-43, Bldg: A, Progress Campus, 941 Progress Ave,Toronto, Toronto, Ontario, Canada, M1G 3T8