IEEE Toronto Newsletter- June 2026

The IEEE Blockchain Forum is returning for the fourth time as part of Toronto Tech Week. The goal of this compact one-day event is to congregate BUIDLers, researchers, academics, and engineers building blockchain protocols, infrastructure, and decentralized software applications. Expect deep thought leadership, executive talks and panels, and academic presentations. We're talking about long-term engineering trends and innovation. You won't find marketing narratives, token launches, or promotions. Note: The 2025 edition of the forum counted with 200 participants and speakers from JP Morgan, the Bank of Canada, Mastercard, the Ethereum Enterprise Alliance, EY, Starknet, among others. IEEE Canada Blockchain Forum 2026 (4th edition)

Abstract: As industry is starting to deploy systems based on 224Gbps/lane and growing pains are becoming more apparent, AI companies are clamoring already for more bandwidth. A first look at 448Gbps is already highlighting the enormous challenges of running even very short links on copper. However, industry doesn’t seem yet ready to throw the towel on pluggable modules as gateways to optical interconnect given the risks and limitations of CPO. Some of the questions that will be covered: - Can we clearly articulate what are the priorities in developing the next generation of interconnect for AI? - What are the main obstacles to the adoption of short reach optics to replace the last inches of electrical connectivity? - What can we learn from advances in C2C and in particular by the success of UCIe? - Does it make sense to still have pluggable modules and what is the best way to do that? - Was LPO a success or a bust and can we move forward with it? - What are the promises and possible pitfalls of CPO? Topics touched upon: - System level (Computing, AI) requirements & considerations (architectural trends, efficiency, bw, latency, cost etc.) - Optical and electrical energy efficiency considerations - HW technology developments and limitations (interposer, packaging, connectors, cables) - System trade offs analysis (retiming vs. linear, vs. CPO) - Chiplets and co-packaging technology - Analysis of latest OIF development on next generation interconnect Agenda: Room: GB202, Bldg: Galbraith Building, University of Toronto, 35 St George Street, Toronto, Ontario, Canada

Reflections on entrepreneurship in integrated photonics and workforce development Abstract: Photonic integrated circuits (PICs) promise improvements in size, weight, power, cost, and functionality compared to bulk/discrete optics and photonics for several applications. In this talk, Dr. McComber will introduce the field of integrated photonics and the histories and trajectories of the two companies he leads, providing insights into the photonics talent pipeline and marketplace as well as lessons learned in entrepreneurship. This talk is relevant for those interested in entrepreneurship and the ever-changing landscape of integrated photonics. Dr. Kevin McComber Speaker(s): Dr. Kevin McComber Virtual: https://events.vtools.ieee.org/m/539458