• Advances in Neuroscience at UFES/Brazil

    Room: 105, Bldg: Eric Palin Hall (EPH), 87 Gerrard St E, Toronto, Ontario, Canada, M5B 2M2

    This seminar will cover topics including: - Devices for Blind People, Amputees, People with Severe Disability - Control of Appliances Through sEMG and EOG, Rehabilitation Through Serious Games - Use of Internet of Things (IoT) for Human Activity Recognition (HAR) Based on Convolutional Neural Network (CNN) - Robots for Interaction with Children with ASD and Down Syndrome - Respiratory Rate Estimation Through Deep Learning Applied to Photoplethysmogram - COVID Detection Through Recurrent Neural Networks (RNN) and Deep Learning (DL) - Several Applications with Brain-Computer Interfaces (BCIs) Based on Electroencephalography (EEG) Speaker(s): Dr. Teodiano Freire Bastos-Filho, Room: 105, Bldg: Eric Palin Hall (EPH), 87 Gerrard St E, Toronto, Ontario, Canada, M5B 2M2

  • Future Communications R&D Programme in Singapore

    Room: BA 1180, Bldg: Bahen Centre, 40 St George St, Toronto, Ontario, Canada

    Communications and connectivity have become the critical foundational technology that supports Singapore’s economy. Singapore has invested close to S$70 million through the launch of Singapore’s first national Future Communications Research and Development Programme (FCP), to jumpstart cutting-edge communications and connectivity research. This grows local capability, to translate into innovative products, services and companies. The programme is hosted by the Singapore University of Technology and Design. FCP encourages collaboration between industry and research ecosystem. It will provide easy access to testbeds to facilitate development of 5G and future communication technologies. FCP seeks to collaborate with R&D partners both domestically and internationally to explore different opportunities to advance capabilities in future communications. Speaker(s): Tony Quek , Room: BA 1180, Bldg: Bahen Centre, 40 St George St, Toronto, Ontario, Canada

  • Algorithms & protocols joint coms, localization, sensing by Dr. George Alexandropoulos

    Virtual: https://events.vtools.ieee.org/m/333747

    Title: Reconfigurable intelligent surfaces: Communications, sensing, and their integration Abstract: The advent of the connected things paradigm within 5G wireless communications enabled various sophisticated applications, whose evolution paves the way for the notion of the connected intelligence of everything in 6G networks. Recent speculations for this upcoming new generation push the 5G performance indicators to unprecedented levels, envisioning THz frequency bands, devices with embedded sensing capabilities, and native AI. All these are expected to become a reality around 2030 and with a strong green footprint. In this talk, we will elaborate around the emerging technology of Reconfigurable Intelligent Surfaces (RISs) which is provisioned as the enabler of smart wireless environments, offering a highly scalable, low-cost, hardware-efficient, and almost energy-neutral solution for the dynamic control of the propagation of electromagnetic signals. We will discuss their evolution from programmable reflecting metamaterials to connected computational- and power-autonomous hybrid metasurfaces, emphasizing on the state-of-the-art approaches for RIS-empowered communications, localization, and sensing. Short Biography: George C. Alexandropoulos received the Engineering Diploma, M.A.Sc., and Ph.D. degrees in Computer Engineering and Informatics from the School of Engineering, University of Patras, Greece in 2003, 2005, and 2010, respectively. He has held research positions at various Greek universities and research institutes, as well as at the Mathematical and Algorithmic Sciences Lab, Paris Research Center, Huawei Technologies France, and he is currently an Assistant Professor with the Department of Informatics and Telecommunications, School of Sciences, National and Kapodistrian University of Athens (NKUA), Greece. He also serves as a Principal Researcher for the Technology Innovation Institute, Abu Dhabi, United Arab Emirates. His research interests span the general areas of algorithmic design and performance analysis for wireless networks with emphasis on multi-antenna transceiver hardware architectures, active and passive Reconfigurable Intelligent Surfaces (RISs), integrated communications and sensing, millimeter wave and THz communications, as well as distributed machine learning algorithms. He currently serves as an Editor for IEEE Transactions on Communications, IEEE Wireless Communications Letters, ELSEVIER Computer Networks, Frontiers in Communications and Networks, and the ITU Journal on Future and Evolving Technologies. In the past, he has held various fixed-term and guest editorial positions for IEEE Transactions on Wireless Communications and IEEE Communications Letters, as well as for various special issues at IEEE journals. Prof. Alexandropoulos is a Senior Member of the IEEE Communications, Signal Processing, and Information Theory Societies, the vice-chair of the (https://eurasip.org/technical-area-committees/), as well as a registered Professional Engineer of the Technical Chamber of Greece. He is also a Distinguished Lecturer of the IEEE Communications Society. He has participated and/or technically managed more than 15 European Union (EU), international, and Greek research, innovation, and development projects. He is currently NKUA's principal investigator for the EU H2020 RISE‑6G and the SNS JU TERRAMETA projects dealing with RIS-empowered smart wireless environments and THz RISs, respectively. For the former project he also serves as the dissemination manager, whereas for the latter, he also serves as the project’s technical manager. Prof. Alexandropoulos has received the best Ph.D. thesis award 2010, the IEEE Communications Society Best Young Professional in Industry Award 2018, the EURASIP Best Paper Award of the Journal on Wireless Communications and Networking 2021, the IEEE Marconi Prize Paper Award in Wireless Communications 2021, and a Best Paper Award from the IEEE GLOBECOM 2021. More information is available at www.alexandropoulos.info. Co-sponsored by: Tamseel Mahmood - syed.tamseel@ieee.org Speaker(s): Dr. Alexandropoulos, Virtual: https://events.vtools.ieee.org/m/333747

  • Cybersecurity and Machine Learning Applications

    Virtual: https://events.vtools.ieee.org/m/337646

    The Internet is the baseline for cyberspace, where technology infrastructure can be autonomous. It is a virtual space that can be accessed via different interconnected network devices. These devices can come from trusted or untrusted sources; therefore, the communication among these devices might be safe and/or unsafe which leads to insecure vulnerable communication in cyberspace. Security in cyberspace, namely Cyber-security can be described as a set of measures that makes cyberspace safe. Identifying threats and predicting vulnerabilities in this environment are the key components of the security mechanism. The main cause of security violations is the intrusion of an attacker into the network or the devices. Machine learning is one of the branches of artificial intelligence which can be used to increase the accuracy level for detecting threats in cyberspace to improve the system's efficiency and performance. In this talk, how machine learning can help detect and mitigate cyber threats is presented. Speaker(s): Dr. Mizanur Rahman, Virtual: https://events.vtools.ieee.org/m/337646

  • IEEE EPS Distinguished Lecture: Chiplet Design and Heterogeneous Integration Packaging

    Bldg: Bahen Centre for Information Technology, 40 St George St, Room BA1240, Toronto, Ontario, Canada, M5S 2E4, Virtual: https://events.vtools.ieee.org/m/335514

    [] Please note that this lecture has unfortunately had to be cancelled. Lecture notes from the talk will be shared with registrants. We sincerely apologize for the inconvenience. The IEEE Toronto Electronics Packaging Society is proud to present Distinguished Lecturer Dr. John Lau of Unimicron Technology Corporation and his talk on "Chiplet Design and Heterogeneous Integration Packaging". Abstract Chiplet is a chip design method and heterogeneous integration is a chip packaging method. Heterogeneous integration uses packaging technology to integrate dissimilar chips, photonic devices, and/or components (either side-by-side, stacked, or both) with different sizes and functions, and from different fabless design houses, foundries, wafer sizes, feature sizes and companies into a system or subsystem on a common package substrate. For the next few years, we will see more implementations of a higher level of chiplet designs and heterogeneous integration packaging, whether it is for time-to-market, performance, form factor, power consumption or cost. In this lecture, the introduction, recent advances, and trends in chiplet design and heterogeneous integrationpackaging will be presented. Please join us Tuesday, December 13th at 11 AM in BA1240. The event will also be streamed live on Zoom for those who cannot attend in person. Food and refreshments will be served. Speaker(s): Dr. John H Lau, Bldg: Bahen Centre for Information Technology, 40 St George St, Room BA1240, Toronto, Ontario, Canada, M5S 2E4, Virtual: https://events.vtools.ieee.org/m/335514

  • Paving the Way Towards Mobile IAB: Problems, Solutions and Challenges

    Virtual: https://events.vtools.ieee.org/m/337093

    5G networks are being designed and deployed considering a dense deployment of small cells in order to simultaneously serve more users with higher throughput and lower delay. However, building from scratch a completely new infrastructure is costly and takes time. Deploying access and backhaul as wireless links, a.k.a. integrated access and backhaul (IAB), is envisioned as a viable approach to enable flexible and dense networks. Even further, mobile IAB (mIAB) is a candidate solution to enhance the connectivity of users moving together. Motivated by this, in this talk, we firstly present the basic architecture of IAB. Then, we provide the main use cases of mIAB. After that, an extensive performance analysis is presented. Passengers and pedestrians quality of service is evaluated. Moreover, results related to the wireless backhaul are also presented. The mIAB scenario is compared to two benchmark solutions, i.e., a scenario with only macro gNBs and a scenario with macro and pico gNBs fiber-connected to the core network. Finally, we summarize the lessons learned and list some open issues and future directions. Speaker(s): Victor Monteiro, Francisco Rafael Lima Virtual: https://events.vtools.ieee.org/m/337093

  • SSCS Workshop: Pushing the Frontiers in Wireline Communication

    Room: SF1105, Bldg: Sanford Fleming Building, 10 King's College Road, University of Toronto, Toronto, Ontario, Canada, M5S 3G4

    Registration is free but required for this exciting in-person event. Detailed Agenda: 08:45 - 09:10 Coffee 09:10 - 09:15 Welcome Remarks: Dustin Dunwell, Toronto SSCS Chapter Vice-Chair 09:15 - 09:20 Opening Remarks: Ali Sheikholeslami, SSCS VP Education 09:20 - 10:20 Pushing the Energy Frontier in Wireline Communication - Davide Tonietto, Huawei Canada 10:20 - 10:40 Break 10:40 - 11:20 Pushing the Data Rates in Wireline Communication - Ali Sheikholeslami, University of Toronto, Canada 11:20 - 12:00 Error Propagation Detection and Correction in Wireline Communication - Hossein Shakiba, Huawei Canada 12:00 - 13:00 Lunch 13:00 - 13:40 Short Reach Interconnects for the Emerging Multi-Die System Era - Dino Toffolon, Synopys Canada 13:40 - 14:20 Interconnect IP: Past, Present, and into the Future - Robert Wang, Rambus Canada 14:20 - 14:40 Break 14:40 - 15:20 Trends in Wireline Communication - Kevin Parker, Marvell 15:20 - 16:00 Optimization Tools for Future Wireline Transceivers - Tony Chan Carusone, University of Toronto, Canada, and Alphawave 16:00 - 16:25 Panel Discussion, Moderated by Dustin Dunwell 16:25 - 16:30 Concluding Remarks, Dustin Dunwell Co-sponsored by: University of Toronto Room: SF1105, Bldg: Sanford Fleming Building, 10 King's College Road, University of Toronto, Toronto, Ontario, Canada, M5S 3G4

  • LMAG Chair Teleconference Agenda 2022-Dec-19 4:00 PM (EST)

    Oakville, Ontario, Canada, L6H 2B1, Virtual: https://events.vtools.ieee.org/m/338448

    R7 LMAG MONTHLY MEETING Oakville, Ontario, Canada, L6H 2B1, Virtual: https://events.vtools.ieee.org/m/338448

  • LMAG Chair Teleconference Agenda 2023-Jan 16 at 4:00 PM (EST)

    Oakville, Ontario, Canada, L6H 2B1, Virtual: https://events.vtools.ieee.org/m/343308

    R7 LMAG Executive Teleconference - MONTHLY MEETING Oakville, Ontario, Canada, L6H 2B1, Virtual: https://events.vtools.ieee.org/m/343308

  • Humber College Competitive Programming Workshops

    Room: F212, Bldg: F 2nd floor, 205 Humber College Blvd, Etobicoke, Ontario, Canada, M9W5L7

    Dr. Andrew Rudder will be teaching programming concepts with a focus on competitive programming. Various languages may be used. You should be familiar with any of the following programming languages Java, C#, C, C++ or python. A basic knowledge of selection logic (such as if statements), loops and functions are sufficient. This is a prerequisite for Humber IEEE Students attending IEEExtreme competitions. Course continues depending on registration. Course is free. Available to any current Humber students. Course will probably last until October 2022. Breaks for Humber Midterm exams, final exams and reading weeks. Co-sponsored by: Dr. Andrew Rudder Room: F212, Bldg: F 2nd floor, 205 Humber College Blvd, Etobicoke, Ontario, Canada, M9W5L7

  • Humber College Arduino Workshops.

    Room: J233a, Bldg: H, 2nd Floor, 205 Humber College Blvd, Etobicoke, Ontario, Canada, M9W5L7

    Weekly, In-Person Arduino Workshop with various peripherals and how to interface them. Beginner to Expert level. LED Displays, Infrared, Matrix Keyboard, sound, DHT sensors, Servos, LED Strips, Analog Inputs... and whatever else the students bring to the table. This event focused Lasers and I2C protocol, DS3231 Room: J233a, Bldg: H, 2nd Floor, 205 Humber College Blvd, Etobicoke, Ontario, Canada, M9W5L7

  • Distinguished Lecture Series: Wide Tuning-Range VCOs Using Multi-Mode Resonators

    Room: BA B025, Bldg: Bahen Centre for Information Technology, 40 St George St, Toronto, Ontario, Canada, M5S 2E4, Virtual: https://events.vtools.ieee.org/m/342962

    LC VCOs are commonly used for RF carrier generation. A wide tuning range in a single VCO is desirable for covering multiple bands while occupying a small area. An octave tuning range enables continuous coverage of all lower frequencies by integer frequency division. LC VCOs are most often tuned using variable capacitor banks and varactors. Because of switch resistances in capacitor banks and poor quality factor of varactors, using only capacitors for tuning degrades the phase noise, especially at millimeter-wave frequencies. Variable inductors using series switches pose the same problem. Mutual coupling can be exploited to realize multiple resonant modes with different effective inductances without using switches. This allows a wider tuning range without substantial reduction in the tank quality factor. Topologies for multi-mode resonant structures and their performance will be described with examples from the literature. Speaker(s): Dr. Krishnapura, Room: BA B025, Bldg: Bahen Centre for Information Technology, 40 St George St, Toronto, Ontario, Canada, M5S 2E4, Virtual: https://events.vtools.ieee.org/m/342962