Solid-State Circuits

Network-based telemetry is embedded into virtually all modern products and systems in order to create new value for end users. Think of the Tesla automobile, that can update its own operating software, so the brakes work better! Pre-university ECE students need exposure to the hardware and protocols used in Internet-of-Things (“IoT”) enabled products, as well as the special challenges of designing these products. This 3-course, 12-week workshop will help you incorporate networking concepts and technology into your curriculum, and provide opportunities for your students to practice adding networking functionality to embedded projects. The courseware is based on a simple, network-enabled line-following robot based on the Raspberry Pi Pico W board, which will be provided to each participant. This training is targeted towards Grade 11/12 Computer or Electronics Engineering Teachers (Ontario TEJ/ICS Curriculum), and will be delivered virtually using a Learning Management System, combined with weekly live Q/A sessions to verify mastery of the material. When registering, please complete all address fields, so we can ship you a robot kit in time for the first session! To learn more about the courses that will be covered in this workshop, please visit the following page: https://www.cool-mcu.com/bundles/ieee-iot-workshop-for-pre-university-educators Agenda: Kick-Off Meeting Agenda: Outcomes Courses & Topic Coverage IoT Robot Hardware Review Using the LMS Detailed Training Schedule Assigned reading and lab exercise Virtual: https://events.vtools.ieee.org/m/328095

Progress in computation and communication is increasingly bottlenecked by integrated circuit I/0. CMOS technology scaling has enabled the integration of hundreds of complete modems operating over 100Gbps on a single chip. Whereas optical links were previously reserved for communication over 100's of kilometres, they are now the primary solution for chip-to-chip links above 100 Gbps over any distance beyond a few metres. Co-packaged optics (CPO) bring optics right to the perimeter of our electronic integrated circuits, and may therefore appear to be a natural continuation of this trend. Indeed, PO holds the promise of simultaneously lowering system power consumption, decreasing I/0 latency, and increasing the total bandwidth of chip I/O. And yet, at the same time, it has the potential to increase the power density, increase the cost, and limit the bandwidth density of our chio I/O. This talk will clarify these seeming contradictions, and paint a realistic picture of CPO's role in future connectivity. Co-sponsored by: SPIE OPTICA Student Chapter Speaker(s): Dr. Tony Chan Carusone, Room: GB119, Bldg: Galbraith Building, University of Toronto, Toronto, Ontario, Canada