Please join us for an upcoming talk on Feb 07, 4-5 pm (Eastern Time) by Prof. Erik Lier titled "Practical Antenna Solutions Enabled by Soft and Hard EM Surfaces and Metasurfaces", as part of the 2021-2022 IEEE AP-S seminar series. Abstract: The presentation will describe how the concept of electromagnetically soft and hard surfaces and later metamaterial horns (metahorns) came about. The talk will also discuss practical antenna solutions enabled by these EM techniques, as well as future opportunities and challenges in antenna and RF designs. About Speaker: Dr. Erik Lier received his M.Sc. and Ph.D. from the Norwegian University of Science and Technology, Trondheim, Norway. He started working as a university scientific assistant and later as a research scientist at the Electronics Laboratory (ELAB/SINTEF) at the university, carrying out national and international research on microwave antennas and feed components for the European Space Agency (ESA), INTELSAT, INMARSAT and other satellite organizations and radar companies. He spent a year at UCLA as a visiting scholar studying phased array antenna technology. He co-invented the concept of “Soft and Hard electromagnetic surfaces” which is related to the field of electromagnetic bandgap (EBG) structures and complex surfaces. Since 1990 he has been with Lockheed Martin Space, where he has been involved in developing new spacecraft antenna and payload technology. He was instrumental in building up shaped reflector capability in the company which resulted in winning the Asiasat-2 satellite program. He has been involved in the development and modernization of the GPS satellite payload for over more than 20 years. His main research interest and contribution has been in the field of phased array antennas, including design, analysis, system engineering, calibration and test. He was the phased array architect for two phased arrays launched into space. He headed up the internal metamaterials research collaboration effort within the company, which has included university collaboration and has led to several groundbreaking and practical metamaterial-enhanced antennas for space and ground applications. He is granted 37 US patents, has authored and co-authored over 140 journal and conference papers, including two papers in the journal Nature, co-authored one book and authored a book chapter. He received the 2014 IEEE Antennas and Propagation Harold A. Wheeler Applications Prize Paper Award. He is a Lockheed Martin Senior Technical Fellow, a Life Fellow of IEEE and a Fellow of IET. Speaker(s): Erik Lier Virtual: https://events.vtools.ieee.org/m/302402
Electromagnetics & Radiation
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Practical Antenna Solutions Enabled by Soft and Hard EM Surfaces and Metasurfaces by Prof. Erik Lier
Practical Antenna Solutions Enabled by Soft and Hard EM Surfaces and Metasurfaces by Prof. Erik Lier
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The design of advanced integrated circuits and microsystems from zero to terahertz frequencies calls for fast and accurate electromagnetics-based modeling and simulation. The sheer complexity and high design cost associated with the integrated circuits and microsystems prevent one from designing them based on hand calculation, approximation, intuition, or trial and error. The move towards higher frequencies and heterogeneous technologies stresses the need even more. However, the analysis and design of integrated circuits (ICs) and microsystems impose many unique challenges on electromagnetic analysis such as exponentially increased problem size and extremely multiscaled system spanning from nano- to centi-meter scales. These challenges become new driving forces of the advancement of Computational Electromagnetics (CEM) in recent years, since past techniques do not address them well. In this talk, recent advances in fast direct solvers of O(N) (optimal) complexity will be presented, including both direct PDE and IE solvers, for addressing the ultra large problem size encountered in the IC design problems. In these solvers, the underlying dense or sparse system matrix is directly inverted or factorized in O(N) complexity. To show how these solvers work, a series of new accuracy controlled fast matrix arithmetic will be elaborated including the representation of a dense matrix of O(N2) elements using O(N) parameters with controlled accuracy, subsequent matrix-matrix multiplication, matrix factorization, and inversion performed in O(N) complexity with directly controlled accuracy. The application of these fast algorithms to the design and analysis of industry product-level integrated circuits and systems will be presented. Comparisons with direct and iterative solvers in the past will be made, which demonstrate the clear advantages of the new O(N) direct solvers. Co-sponsored by: Center for Computational Science and Engineering (CCSE), Faculty of Applied Science and Engineering, University of Toronto Speaker(s): Dan Jiao Biography: Dan Jiao received the Ph.D. degree in electrical engineering from the University of Illinois at Urbana-Champaign, Urbana, IL, USA, in 2001. She then joined the Technology Computer-Aided Design (CAD) Division, Intel Corporation, until September 2005, where she was a Senior CAD Engineer, Staff Engineer, and Senior Staff Engineer. In September 2005, she joined Purdue University, West Lafayette, IN, USA, as an Assistant Professor with the School of Electrical and Computer Engineering. She is currently a Professor with Purdue University. She has authored 3 book chapters and over 300 papers in refereed journals and international conferences. Her current research interests include computational electromagnetics; high-frequency digital, analog, mixed-signal, and RF integrated circuit (IC) design and analysis; high-performance very large scale integration (VLSI) CAD; modeling of microscale and nanoscale circuits; applied electromagnetics; fast and high-capacity numerical methods; fast time-domain analysis, scattering and antenna analysis; RF, microwave, and millimeter-wave circuits; wireless communication; and bioelectromagnetics. Dr. Jiao has served as a reviewer for many IEEE publications and conferences. She is an associate editor for the IEEE Transactions on Components, Packaging, and Manufacturing Technology. She was the recipient of the 2013 S. A. Schelkunoff Prize Paper Award of the IEEE Antennas and Propagation Society, which recognizes the Best Paper published in the IEEE Transactions on Antennas and Propagation during the previous year. She has been named a University Faculty Scholar by Purdue University since 2013. She was among the 85 engineers selected throughout the nation for the National Academy of Engineerings 2011 U.S. Frontiers of Engineering Symposium. She was the recipient of the 2010 Ruth and Joel Spira Outstanding Teaching Award, the 2008 National Science Foundation (NSF) CAREER Award, the 2006 Jack and Cathie Kozik Faculty Start Up Award (which recognizes an outstanding new faculty member of the School of Electrical and Computer Engineering, Purdue University), a 2006 Office of Naval Research (ONR) Award under the Young Investigator Program, the 2004 Best Paper Award presented at the Intel Corporation’s annual corporate-wide technology conference (Design and Test Technology Conference) for her work on generic broadband model of high-speed circuits, the 2003 Intel Corporation Logic Technology Development (LTD) Divisional Achievement Award, the Intel Corporation Technology CAD Divisional Achievement Award, the 2002 Intel Corporation Components Research Award, the Intel Hero Award (Intel-wide she was the tenth recipient), the Intel Corporation LTD Team Quality Award, and the 2000 Raj Mittra Outstanding Research Award presented by the University of Illinois at Urbana–Champaign. Register: https://events.vtools.ieee.org/m/303190 |
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