Electromagnetics & Radiation

Abstract: In this talk, we present our recent research involving the development of low profile antennas that are used to replace wired interconnects in multi-chip modules in electronic packaging. This presentation will discuss the evolution of chip-compatible pattern adaptable mm-wave antenna modules to be used in massively multicore computers. The result is an enabling technology that overcomes technology bottlenecks that are prevalent when wired lines are used in interconnect busses. While device technologies have scaled, the interconnection layers have not. The limits are in the pitch of the input and output (I/O) for chip-to-chip communications and losses due to physical transmission lines. This is a unique type of pattern adaptable antenna array in that the antenna patterns are in the same plane as the antenna elements. This is quite a departure from many other types of reconfigurable antennas where the patterns are broadside (90 degree angle) to the antennas. The approach is new in that it leverages mm-wave technology (60GHz) so that the antenna size is small. 60GHz allows the work to leverage the already-developed transceiver work done for WPAN technologies. 60GHz also has a natural attenuation at large transmission distances, which means sufficient isolation and elimination of interference outside of the MCMC system. The research impacts antenna technology, packaging technology (circuit stacking and advanced packaging), and wireless systems testing on an experimental testbed. The talk will focus on the story behind how the technology progresses and how the research unfolded along the way. Contact: UofT AP-S Student Chapter