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SSCS Workshop: Pushing the Frontiers in Wireline Communication

Room: SF1105, Bldg: Sanford Fleming Building, 10 King's College Road, University of Toronto, Toronto, Ontario, Canada, M5S 3G4

Registration is free but required for this exciting in-person event. Detailed Agenda: 08:45 - 09:10 Coffee 09:10 - 09:15 Welcome Remarks: Dustin Dunwell, Toronto SSCS Chapter Vice-Chair 09:15 - 09:20 Opening Remarks: Ali Sheikholeslami, SSCS VP Education 09:20 - 10:20 Pushing the Energy Frontier in Wireline Communication - Davide Tonietto, Huawei Canada 10:20 - 10:40 Break 10:40 - 11:20 Pushing the Data Rates in Wireline Communication - Ali Sheikholeslami, University of Toronto, Canada 11:20 - 12:00 Error Propagation Detection and Correction in Wireline Communication - Hossein Shakiba, Huawei Canada 12:00 - 13:00 Lunch 13:00 - 13:40 Short Reach Interconnects for the Emerging Multi-Die System Era - Dino Toffolon, Synopys Canada 13:40 - 14:20 Interconnect IP: Past, Present, and into the Future - Robert Wang, Rambus Canada 14:20 - 14:40 Break 14:40 - 15:20 Trends in Wireline Communication - Kevin Parker, Marvell 15:20 - 16:00 Optimization Tools for Future Wireline Transceivers - Tony Chan Carusone, University of Toronto, Canada, and Alphawave 16:00 - 16:25 Panel Discussion, Moderated by Dustin Dunwell 16:25 - 16:30 Concluding Remarks, Dustin Dunwell Co-sponsored by: University of Toronto Room: SF1105, Bldg: Sanford Fleming Building, 10 King's College Road, University of Toronto, Toronto, Ontario, Canada, M5S 3G4

Paving the Way Towards Mobile IAB: Problems, Solutions and Challenges

Virtual: https://events.vtools.ieee.org/m/337093

5G networks are being designed and deployed considering a dense deployment of small cells in order to simultaneously serve more users with higher throughput and lower delay. However, building from scratch a completely new infrastructure is costly and takes time. Deploying access and backhaul as wireless links, a.k.a. integrated access and backhaul (IAB), is envisioned as a viable approach to enable flexible and dense networks. Even further, mobile IAB (mIAB) is a candidate solution to enhance the connectivity of users moving together. Motivated by this, in this talk, we firstly present the basic architecture of IAB. Then, we provide the main use cases of mIAB. After that, an extensive performance analysis is presented. Passengers and pedestrians quality of service is evaluated. Moreover, results related to the wireless backhaul are also presented. The mIAB scenario is compared to two benchmark solutions, i.e., a scenario with only macro gNBs and a scenario with macro and pico gNBs fiber-connected to the core network. Finally, we summarize the lessons learned and list some open issues and future directions. Speaker(s): Victor Monteiro, Francisco Rafael Lima Virtual: https://events.vtools.ieee.org/m/337093

IEEE EPS Distinguished Lecture: Chiplet Design and Heterogeneous Integration Packaging

Bldg: Bahen Centre for Information Technology, 40 St George St, Room BA1240, Toronto, Ontario, Canada, M5S 2E4, Virtual: https://events.vtools.ieee.org/m/335514

[] Please note that this lecture has unfortunately had to be cancelled. Lecture notes from the talk will be shared with registrants. We sincerely apologize for the inconvenience. The IEEE Toronto Electronics Packaging Society is proud to present Distinguished Lecturer Dr. John Lau of Unimicron Technology Corporation and his talk on "Chiplet Design and Heterogeneous Integration Packaging". Abstract Chiplet is a chip design method and heterogeneous integration is a chip packaging method. Heterogeneous integration uses packaging technology to integrate dissimilar chips, photonic devices, and/or components (either side-by-side, stacked, or both) with different sizes and functions, and from different fabless design houses, foundries, wafer sizes, feature sizes and companies into a system or subsystem on a common package substrate. For the next few years, we will see more implementations of a higher level of chiplet designs and heterogeneous integration packaging, whether it is for time-to-market, performance, form factor, power consumption or cost. In this lecture, the introduction, recent advances, and trends in chiplet design and heterogeneous integrationpackaging will be presented. Please join us Tuesday, December 13th at 11 AM in BA1240. The event will also be streamed live on Zoom for those who cannot attend in person. Food and refreshments will be served. Speaker(s): Dr. John H Lau, Bldg: Bahen Centre for Information Technology, 40 St George St, Room BA1240, Toronto, Ontario, Canada, M5S 2E4, Virtual: https://events.vtools.ieee.org/m/335514