Events

While silicon scaling has reached astonishing levels over the last half century, there has not been a corresponding level of scaling in electronic packaging technology. However, Artificial Intelligence (AI) architectures are now changing the landscape, increasingly moving us towards chiplets and advanced packaging technology, especially Heterogeneous Integration (HI). What are these unique requirements of AI which are driving the need for HI? What are some of the unique challenges in semiconductor and packaging technologies that must be overcome to make this successful? This seminar will discuss key HI methods including interposers, fan out wafer level processing, silicon bridges, and 3D integration. We will look at their attributes as well as their challenges, to determine how they can be leveraged to achieve AI architectures. Speaker:  Dr. Mukta Farooq, IBM Distinguished Research Scientist, IEEE Fellow  

The IEEE Blockchain Forum is returning for the fourth time as part of Toronto Tech Week. The goal of this compact one-day event is to congregate BUIDLers, researchers, academics, and engineers building blockchain protocols, infrastructure, and decentralized software applications. Expect deep thought leadership, executive talks and panels, and academic presentations. We're talking about long-term engineering trends and innovation. You won't find marketing narratives, token launches, or promotions. Note: The 2025 edition of the forum counted with 200 participants and speakers from JP Morgan, the Bank of Canada, Mastercard, the Ethereum Enterprise Alliance, EY, Starknet, among others. IEEE Canada Blockchain Forum 2026 (4th edition)