On Friday, February 5, 2021 at 10:00 a.m., IEEE Toronto WIE will host a Python workshop, “How to Use LSTM for Text and Time Series Classification”. Day & Time: Friday, February 5, 2021 10:00 a.m. – 12:00 p.m. Speaker(s): Enas Tarawneh Organizer(s): IEEE Toronto WIE, York University WiCSE Location: Virtual Contact: Hina Tabassum Abstract: This workshop focuses on how to classify or label text using bi-LSTM RNNs. It includes pre-processing/cleaning of the text and handling severely imbalanced classes using SMOTE, oversampling, under-sampling, class count, and log smoothen weights. Using different types of LSTM such as vanilla LSTM, and Bi-LSTM, we focus on time series problems with categorical data. In summary, this workshop will cover: a) Preprocessing text and data b) Handling imbalanced datasets c) Use different types of LSTMs for text and time series classification d) Produce meaningful classification reports Register: Please visit http://bit.ly/39IQFXd to register. Biography: Enas Tarawneh is a PhD student at York University in the department of Computer Science and Electrical Engineering. She works in the Vision, Graphics and Robotics (VGR) Laboratory as a research assistant. Her most recent research involves the development and evaluation of a cloud-based avatar (intelligent agent) for human-robot interaction that is part of a project funded by VISTA. She holds an OGS and VISTA doctoral scholarship. Prior to this, Enas worked as an academic Lead, instructor, and e-learning coordinator in the Institute of Applied Technology in UAE in which she received an award for “Distinguished Curriculum Support” and another for “Excellence in E-learning coordination”. Most importantly, Enas is a wife and mother of three, that believes that open-mindedness and positivism is the best accomplishment and the source of true happiness.
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On Monday, February 8, 2021 at 11:00 a.m., IEEE Antennas and Propagation Society is hosting “Glide Symmetries: A New Degree of Freedom for the Design of Periodic Structures”. Day & Time: Monday, February 8, 2021 11:00 a.m. – 12:30 p.m. Speaker: Oscar Quevedo-Teruel of KTH Royal Institute of Technology Organizer(s): IEEE Antennas and Propagation Society Location: Virtual – Zoom Contact: George Eleftheriades Abstract: Glide symmetries were employed for electromagnetic purposes during the 60s and 70s. Those works were focused on one-dimensional structures with potential application in low-dispersive leaky wave antennas. However, the development of planar/printed technologies in the 80s and 90s associated to their low-cost for low-frequency applications, the studies of glide symmetries stopped. In the beginning of the 21st century, with arrival of metamaterials, there was a significant development of the understanding of periodic structures, and new methods of analysis were introduced. This theoretical development, together with the interest of industry in mm-waves, particularly for communications systems such as 5G, created an opportunity to explore the possibilities of glide symmetries, especially in two-dimensional configurations. Glide-symmetric structures has recently attracted the attention of researchers due to their attractive properties for practical applications. Among their interesting properties are low-dispersive responses in fully metallic structures such as parallel plate or co-planar waveguides (CPW), bandgaps associated to the symmetries and large electromagnetic bandgaps (EBGs). In this talk, Dr. Quevedo-Teruel will describe the most significant works in glide symmetries, including their application for the design of gap-waveguide technology and planar lens antennas with steerable angles of radiation. Register: Please visit https://events.vtools.ieee.org/m/256420 to register. Biography: Oscar Quevedo-Teruel is a Senior Member of the IEEE. He received his Telecommunication Engineering Degree from Carlos III University of Madrid, Spain in 2005, part of which was done at Chalmers University of Technology in Gothenburg, Sweden. He obtained his Ph.D. from Carlos III University of Madrid in 2010 and was then invited as a postdoctoral researcher to the University of Delft (The Netherlands). From 2010-2011, Dr. Quevedo-Teruel joined the Department of Theoretical Physics of Condensed Matter at Universidad Autonoma de Madrid as a research fellow and went on to continue his postdoctoral research at Queen Mary University of London from 2011-2013. In 2014, he joined the Division for Electromagnetic Engineering in the School of Electrical Engineering and Computer Science at KTH Royal Institute of Technology in Stockholm, Sweden where he is an Associate Professor and Director of the Master Programme in Electromagnetics Fusion and Space Engineering. He has been an Associate Editor of the IEEE Transactions on Antennas and Propagation since 2018 and is the founder and editor-in-chief of the EurAAP journal Reviews of Electromagnetics. He was the EurAAP delegate for Sweden, Norway, and Iceland from 2018-2020 and he is now a member of the EurAAP Board of Directors. He is a distinguished lecturer of the IEEE Antennas and Propagation Society for the period of 2019-2022, and Chair of the IEEE APS Educational Initiatives Programme since 2020. He has made scientific contributions to higher symmetries, transformation optics, lens antennas, metasurfaces, leaky wave antennas, and high impedance surfaces. He is the co-author of 95 journal papers and 150 at international conferences. |
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On Thursday, February 11, 2021 at 2:50 p.m., Wendem Tsegaye Beyene will present the talk “Design And Analysis Of Chiplet Interfaces For Heterogeneous Systems”. Day & Time: Thursday, February 11, 2021 2:50 p.m. – 3:50 p.m. Speaker: Wendem Tsegaye Beyene Organizer(s): IEEE Silicon Valley/SF Bay Area Electronics Packaging Chapter Location: Virtual – Directions for connecting with the WebEx stream will be sent via email to all registrants 1-2 days prior to the event. Contact: Durand Jarrett-Amor, Annette Teng Abstract: The chiplet interface allows multiple silicon dies of various technologies and complexities to communicate efficiently using larger parallel interconnects in a single package. The second layer of interconnect on the package (silicon or organic interposer) provides dense channels as well as low impedance power delivery paths between multiple independent power domains. Although the channels are very short and the I/O power can be reduced by an order of magnitude, the huge increase in the transient current in multiple dies and the unique clocking architecture makes the supply noise and timing jitter the limiting factors in designing high-performance multi-die systems. This talk discusses the unique signal and power integrity challenges of chiplet interfaces. Register: Please visit https://eps2102.eventbrite.com to register for this event. Biography: Wendem Beyene received his B.S. and M.S. degrees in Electrical Engineering from Columbia University, and his Ph.D. degree in Electrical and Computer Engineering from University of Illinois at Urbana-Champaign. In the past, he was employed by IBM, Hewlett-Packard, Agilent Technologies and Rambus Inc. He also worked as a principal Engineer with Intel Corp. managing a team working on modeling and analysis of power-delivery and signaling systems of digital-core and mixed-signal I/O subsystems of FPGA chips. He is an elected Associate Fellow of the Ethiopian Academy of Sciences, and has been selected as a Distinguished Llecturer for IEEE EPS as well as for IEEE EMCS Society. |
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Recorded Material: Please click here to view the recorded technical talk. On Thursday, February 18, 2021 at 6:00 p.m., IEEE Computer Chapter is hosting the technical talk “Derivative Data Security using Artificial Intelligence”. Day & Time: Thursday, February 18, 2021 6:00 p.m. – 9:00 p.m. Speaker: Zia Babar Organizer: IEEE Toronto Computer Chapter Location: Since this will be a virtual event we will relay the connectivity information later to individual registrants on their email addresses. Contact: Younas Abbas Abstract: Data security the most dynamic and ever evolving trade becomes even significant while dealing with large volumes of unstructured data. To comply with regulation and standards like GDPR it is important to understand, equip and keep abreast of new tools and techniques in data security. Enterprises are increasingly storing large volumes of unstructured data. However, irrespective of the data format or type, unstructured data is difficult to secure and control its transfer. This is a major problem due to evolving compliance policies and the need to adhere to standards such as GDPR. Through derivative data security practices, enterprises can utilize machine learning and deep learning techniques to determine and trace clones and derivatives of unstructured data across the enterprise. In this talk, Zia Babar will provide a background on data security approaches, and provide a demonstration on machine learning and deep learning techniques can be used for providing derivative data security. Register: Please visit https://events.vtools.ieee.org/m/252704 to register. Biography: Zia Babar (https://www.linkedin.com/in/zbabar/) has 20 years of professional industry experience, He has deep expertise in the design, development and deployment of enterprise applications, data engineering platforms and distributed systems, with a particular focus on incorporating machine learning practices and cognitive services into software applications. Zia obtained his PhD from the University of Toronto where his research studies focused on the analysis and design of cognitive systems for enabling enterprise transformation. He is presently the Director of Research and Development at WinMagic. Previously, he worked in companies like Teradata where he developed Teradata’s first ML framework, NCR where he was responsible for designing and developing large-scale data processing systems, and Luminous Networks (acquired by Cisco) where he designed and built distributed systems. He is also presently engaged in a multi-year research engagement with IBM Research Labs and is a startup technical mentor at WeWork Labs. Further, he is the organizer of multiple technology meetup groups in both Toronto and Waterloo, and a frequent speaker at technical events and conferences. |
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On Tuesday, February 23, 2021 at 1:30 p.m., Michael J. Gay from Isola will present the technical presentation “Isola High Speed Materials and Copper Foil Selection“. Day & Time: Tuesday, February 23, 2021| 1:30 p.m. – 2:30 p.m. Speaker: Michael J. Gay Organizer(s): IEEE KW EMC/MAG joint Chapter, University of Toronto AP Student Chapter Location: Virtual – WebEx Contact: Ming Chang Wang, Parinaz Naseri Abstract: Are you running 10Gbps+ signal channel in your system? What PCB materials are suitable for 10Gbps+ application? How copper layer surface roughness affecting Signal Integrity, RF, etc? IEEE KW EMC/MAG joint Chapter and University of Toronto AP Student Chapter invite you to join this technical presentation of “Isola High Speed Materials and Copper Foil Selection” by Michael J. Gay from Isola. This event will be recorded for Asia Region attendees. Please register even you are not able to join live, so that you will be provided for a link with the recorded version later. Agenda: SI (Signal Integrity) Performance – Laminate versus SITV (Signal Integrity Test Vehicle) testing Tech road map Comparing Isola HSD product options Copper foil performance factors Isola Product Stack Isola foil testing method and results Register: Please visit https://events.vtools.ieee.org/m/260528 to register. Biography: Michael J. Gay currently holds the position of Director, High Performance Products with Isola. Michael has been with Isola for 20 years and has 25 years of experience in laminate and PCB manufacturing industries. He has held various positions at Isola which include Technical Sales Manager and Director Emerging Products Asia Pacific Region where his responsibilities ranged from new product introduction, PCB process development and technical support and troubleshooting for Isola customers. Since returning from his role in Asia, he has worked closely with major industry OEM’s to develop and qualify Isola materials for the next generation of technology. Michael is also active in various PCB industry organizations where he currently provides technical expertise to industry critical committees and projects. He received his Bachelor of Science in Mechanical Engineering and Masters of Business Administration from Portland State University. |
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