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DTSTART;TZID=America/Toronto:20210119T180000
DTEND;TZID=America/Toronto:20210119T200000
DTSTAMP:20260421T075653
CREATED:20210430T023719Z
LAST-MODIFIED:20210501T002148Z
UID:10000342-1611079200-1611086400@www.ieeetoronto.ca
SUMMARY:Career Night Series: Writing Attention Grabbing Resumes
DESCRIPTION:On Tuesday\, January 19\, 2021 at 6:00 p.m.\, IEEE Toronto WIE and IM/RA will host “Career Night Series: Writing Attention Grabbing Resumes & Cover Letters”. \n\n\n\n\nDay & Time: Tuesday\, January 19\, 2021\n9:00 p.m. – 10:30 p.m. \nOrganizers: IEEE Toronto WIE\, IM/RA\, Ryerson Computer Science \nLocation: Virtual \nContact: Wincy Li \nDescription: Unclear about how to tailor a resume to industry jobs? Want to learn how to describe your accomplishments in an impactful manner? In this webinar\, you will learn how to gain the attention of hiring managers with well-written resumes and cover letters! \nFor accessibility needs\, please contact Wincy at wincyli@ryerson.ca as soon as possible. \nRegister: Please visit https://ryerson.zoom.us/webinar/register/WN_K0eDFX2LQtu97tfq0Wpy_w to register.
URL:https://www.ieeetoronto.ca/event/career-night-series-writing-attention-grabbing-resumes/
CATEGORIES:Instrumentation & Measurement,Women in Engineering
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BEGIN:VEVENT
DTSTART;TZID=America/Toronto:20210121T210000
DTEND;TZID=America/Toronto:20210121T223000
DTSTAMP:20260421T075653
CREATED:20210430T023720Z
LAST-MODIFIED:20210501T002239Z
UID:10000343-1611262800-1611268200@www.ieeetoronto.ca
SUMMARY:JOINT EPS/CAS WEBINAR: FLEXIBLE HYBRID ELECTRONICS 2.0
DESCRIPTION:On Thursday\, January 21\, 2021 at 9:00 p.m.\, the IEEE Toronto Circuits & Devices Chapter invites you to attend a Distinguished Lecture webinar co-sponsored by the IEEE OREGON JOINT EPS/CAS CHAPTER. \nDay & Time: Thursday\, January 21\, 2021\n9:00 p.m. – 10:30 p.m. \nSpeaker: Subramanian Iyer of UCLA \nOrganizer(s): IEEE Toronto Circuits & Devices Chapter\, IEEE Oregon Joint EPS/CAS Chapter \nLocation: Virtual (Webex)\nConnect info sent to registered attendees \nContact: Mengqi Wang\, James Morris \nAbstract: In the last few years\, electronics packaging has rightfully emerged from the shadows of CMOS scaling to make a significant impact in high performance and mobile appliance computing. The area of Flexible Hybrid Electronics (FHE) has also developed and is making a significant impact in the area of medical and wellness electronics. The first generation of these devices have\, for most part\, adapted Printed Circuit Board (PCB) technology by using thinner PCBs and assembling either thinned or thin packaged “older” generation of chips on to these platforms\, typically with coarse printed wiring to connect a small number of such chips. This approach\, while immensely useful to get the field going\, needs to adapt and borrow from the both silicon and advanced packaging technology trends\, so that we can advance this trend to the next level. The key paradigm challenges ahead are: scaling the FHE in general – this includes the adoption of dielet (chiplet) technology in more advanced CMOS nodes including edge-AI\, higher performance interconnects\, flexible high-density energy storage\, wireless communication and advanced ergonomics and all of these at lower cost and higher reliability. In this talk we will address these challenges and outline a possible technology roadmap to achieve these goals in the next few years. \nRegister: Please visit https://events.vtools.ieee.org/m/256124 to register. \nBiography: \n\n\n\nSubramanian S. Iyer (Subu) is Distinguished Professor and holds the Charles P. Reames Endowed Chair in the Electrical Engineering Department and a joint appointment in the Materials Science and Engineering Department at the University of California at Los Angeles. He is Director of the Center for Heterogeneous Integration and Performance Scaling (CHIPS). Prior to that he was an IBM Fellow. His key technical contributions have been the development of the world’s first SiGe base HBT\, Salicide\, electrical fuses\, embedded DRAM and 45nm technology node used to make the first generation of truly low power portable devices as well as the first commercial interposer and 3D integrated products. He also was among the first to commercialize bonded SOI for CMOS applications through a start-up called SiBond LLC. More recently\, he has been exploring new packaging paradigms and device innovations that they may enable wafer-scale architectures\, in-memory analog compute and medical engineering applications. He has published over 300 papers and holds over 75 patents. He has received several outstanding technical achievements and corporate awards at IBM. He is an IEEE Fellow\, an APS Fellow and a Distinguished Lecturer of the IEEE EDS and EPS and a member of the Board of Governors of IEEE EPS. He is also a Fellow of the National Academy of Inventors and iMAPS. He is a Distinguished Alumnus of IIT Bombay and received the IEEE Daniel Noble Medal for emerging technologies in 2012 and the 2020 iMAPS Daniel C. Hughes Jr Memorial award. \nList of publications/patents: https://scholar.google.com/citations?user=xXV4oIMAAAAJ&hl=en \nEmail: S.S.Iyer@ucla.edu
URL:https://www.ieeetoronto.ca/event/joint-eps-cas-webinar-flexible-hybrid-electronics-2-0/
CATEGORIES:Circuits & Devices
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Toronto:20210128T161000
DTEND;TZID=America/Toronto:20210128T170000
DTSTAMP:20260421T075653
CREATED:20210430T023720Z
LAST-MODIFIED:20210501T002303Z
UID:10000344-1611850200-1611853200@www.ieeetoronto.ca
SUMMARY:A 26.5625Gbps to 106.25Gbps XSR SerDes with 1.55pJ/bit efficiency in 7nm CMOS
DESCRIPTION:On Thursday\, January 28\, 2021 at 4:10 p.m.\, Ravi Shivnaraine will present give a talk\, “A 26.5625Gbps to 106.25Gbps XSR SerDes with 1.55pJ/bit efficiency in 7nm CMOS”. \nDay & Time: Thursday\, January 28\, 2021\n4:10 p.m. – 5:00 p.m. \nSpeaker(s): Ravi Shivnaraine of Rambus \nOrganizer(s): IEEE Toronto Solid-State Circuits Society \nLocation: Virtual – Zoom \nContact: Saba Zargham \nAbstract: In this talk\, Rambus will review their recent 26.5625Gbps to 106.25Gbps XSR SerDes macro in 7nm CMOS. The talk will go over the system architecture\, self-test features\, and measurement results. A 1.55pJ/b power efficiency and beachfront density of 722Gbps/mm have been achieved. \nRegister: Please visit https://events.vtools.ieee.org/m/257895 to register and to view the Zoom link. \nBiography: Mr. Shivnaraine obtained his Bachelors and Masters from the University of Toronto in 2010 and 2012 respectively. Ravi has experience working on SerDes receivers at Snowbush\, Huawei\, and Rambus at 28Gbps\, 56Gbps\, and 112Gbps. Currently\, he is at AnalogX working on next-generation SerDes in deep sub-micron nodes. His research interests are low power SerDes interfaces and digitally assisted analog techniques.
URL:https://www.ieeetoronto.ca/event/a-26-5625gbps-to-106-25gbps-xsr-serdes-with-1-55pj-bit-efficiency-in-7nm-cmos/
CATEGORIES:Solid-State Circuits
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Toronto:20210128T180000
DTEND;TZID=America/Toronto:20210128T200000
DTSTAMP:20260421T075653
CREATED:20210430T023720Z
LAST-MODIFIED:20210501T002407Z
UID:10000345-1611856800-1611864000@www.ieeetoronto.ca
SUMMARY:IndustrioTech© Seminars - Smart Maintenance
DESCRIPTION:IEEE Toronto WIE and IM/RA is hosting “IndustrioTech”\, a series of seminars on Smart Maintenance (Predictive Maintenance) using variety of technologies. \nDay & Time: Thursday\, January 28\, 2021\n6:00 p.m. – 8:00 p.m. \nSpeakers & Topics: \nDr. Ahmad Barari\nDirector of Advanced Digital Manufacturing and Advanced Digital Metrology Laboratories\, Associate Professor at University of Ontario Institute of Technology\nTopic: LIVE Simulation for Predictive Maintenance \nMohsen Tayefeh\nIndustry 4.0 strategic Business manager\, CAD MicroSolutions\nTopic: Imperative foundations toward Smart Maintenace: Matching up the Technology with the Business Value \nShafiul Alam\nResearch Engineer McMaster Manufacturing Research Institute (MMRI)\nTopic: Predictive Maintenance and Industry 4.0 (Case study Honda manufacturing plant) \nDr. Amir Harandi\nCEO\, Artintech Inc.\nTopic: ML and GA: Artificial Intelligent techniques in Smart Maintenance \nOrganizer(s): IEEE Toronto WIE\, IM/RA \nLocation: Virtual \nContact: Ayda Naserialiabadi \nRegister: Please visit here to register.
URL:https://www.ieeetoronto.ca/event/industriotech-seminars-smart-maintenance/
CATEGORIES:Instrumentation & Measurement,Women in Engineering
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