BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//IEEE Toronto Section - ECPv6.15.17//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-WR-CALNAME:IEEE Toronto Section
X-ORIGINAL-URL:https://www.ieeetoronto.ca
X-WR-CALDESC:Events for IEEE Toronto Section
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:UTC
BEGIN:STANDARD
TZOFFSETFROM:+0000
TZOFFSETTO:+0000
TZNAME:UTC
DTSTART:20250101T000000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART;TZID=UTC:20260306T140000
DTEND;TZID=UTC:20260306T210000
DTSTAMP:20260419T232727
CREATED:20260126T143605Z
LAST-MODIFIED:20260227T153609Z
UID:10000926-1772805600-1772830800@www.ieeetoronto.ca
SUMMARY:The Toronto Wireline Workshop
DESCRIPTION:Abstract:  As industry is starting to deploy systems based on 224Gbps/lane and growing pains are becoming more apparent\, AI companies are clamoring already for more bandwidth. A first look at 448Gbps is already highlighting the enormous challenges of running even very short links on copper. However\, industry doesn’t seem yet ready to throw the towel on pluggable modules as gateways to optical interconnect given the risks and limitations of CPO.  Some of the questions that will be covered:  – Can we clearly articulate what are the priorities in developing the next generation of interconnect for AI? – What are the main obstacles to the adoption of short reach optics to replace the last inches of electrical connectivity? – What can we learn from advances in C2C and in particular by the success of UCIe? – Does it make sense to still have pluggable modules and what is the best way to do that? – Was LPO a success or a bust and can we move forward with it? – What are the promises and possible pitfalls of CPO?  Topics touched upon:  – System level (Computing\, AI) requirements & considerations (architectural trends\, efficiency\, bw\, latency\, cost etc.) – Optical and electrical energy efficiency considerations – HW technology developments and limitations (interposer\, packaging\, connectors\, cables) – System trade offs analysis (retiming vs. linear\, vs. CPO) – Chiplets and co-packaging technology – Analysis of latest OIF development on next generation interconnect  Agenda:    Room: GB202\, Bldg: Galbraith Building\, University of Toronto\, 35 St George Street\, Toronto\, Ontario\, Canada
URL:https://www.ieeetoronto.ca/event/the-toronto-wireline-workshop/
LOCATION:Room: GB202\, Bldg: Galbraith Building\, University of Toronto\, 35 St George Street\, Toronto\, Ontario\, Canada
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=UTC:20260526T010000
DTEND;TZID=UTC:20260526T210000
DTSTAMP:20260419T232727
CREATED:20260226T153601Z
LAST-MODIFIED:20260227T153609Z
UID:10000935-1779757200-1779829200@www.ieeetoronto.ca
SUMMARY:IEEE Canada Blockchain Forum 2026 (4th edition)
DESCRIPTION:The IEEE Blockchain Forum is returning for the fourth time as part of (https://www.torontotechweek.com/). The goal of this compact one-day event is to congregate BUIDLers\, researchers\, academics\, and engineers building blockchain protocols\, infrastructure\, and decentralized software applications.  Note: (https://events.vtools.ieee.org/m/469545) counted with 200 participants and speakers from JP Morgan\, the Bank of Canada\, Mastercard\, the Ethereum Enterprise Alliance\, EY\, Starknet\, among others.  []  Co-sponsored by: Government of Ontario  Agenda:  Agenda TBC  Ontario Investment and Trade Centre\, 250 Yonge Street\, 35th Floor\, Toronto\, Ontario\, Canada\, M5B 2L7
URL:https://www.ieeetoronto.ca/event/ieee-canada-blockchain-forum-2026-4th-edition/
LOCATION:Ontario Investment and Trade Centre\, 250 Yonge Street\, 35th Floor\, Toronto\, Ontario\, Canada\, M5B 2L7
END:VEVENT
END:VCALENDAR