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DTSTART;TZID=America/New_York:20221213T100000
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DTSTAMP:20260417T212947
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SUMMARY:Cybersecurity and Machine Learning Applications
DESCRIPTION:The Internet is the baseline for cyberspace\, where technology infrastructure can be autonomous. It is a virtual space that can be accessed via different interconnected network devices. These devices can come from trusted or untrusted sources; therefore\, the communication among these devices might be safe and/or unsafe which leads to insecure vulnerable communication in cyberspace. Security in cyberspace\, namely Cyber-security can be described as a set of measures that makes cyberspace safe. Identifying threats and predicting vulnerabilities in this environment are the key components of the security mechanism. The main cause of security violations is the intrusion of an attacker into the network or the devices. Machine learning is one of the branches of artificial intelligence which can be used to increase the accuracy level for detecting threats in cyberspace to improve the system’s efficiency and performance. In this talk\, how machine learning can help detect and mitigate cyber threats is presented.\nSpeaker(s): Dr. Mizanur Rahman\,\nVirtual: https://events.vtools.ieee.org/m/337646
URL:https://www.ieeetoronto.ca/event/cybersecurity-and-machine-learning-applications/
LOCATION:Virtual: https://events.vtools.ieee.org/m/337646
CATEGORIES:Systems
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SUMMARY:IEEE EPS Distinguished Lecture: Chiplet Design and Heterogeneous Integration Packaging
DESCRIPTION:[]\nPlease note that this lecture has unfortunately had to be cancelled. Lecture notes from the talk will be shared with registrants. We sincerely apologize for the inconvenience.\nThe IEEE Toronto Electronics Packaging Society is proud to present Distinguished Lecturer Dr. John Lau of Unimicron Technology Corporation and his talk on “Chiplet Design and Heterogeneous Integration Packaging”.\nAbstract\nChiplet is a chip design method and heterogeneous integration is a chip packaging method. Heterogeneous integration uses packaging technology to integrate dissimilar chips\, photonic devices\, and/or components (either side-by-side\, stacked\, or both) with different sizes and functions\, and from different fabless design houses\, foundries\, wafer sizes\, feature sizes and companies into a system or subsystem on a common package substrate. For the next few years\, we will see more implementations of a higher level of chiplet designs and heterogeneous integration packaging\, whether it is for time-to-market\, performance\, form factor\, power consumption or cost. In this lecture\, the introduction\, recent advances\, and trends in chiplet design and heterogeneous integrationpackaging will be presented.\nPlease join us Tuesday\, December 13th at 11 AM in BA1240. The event will also be streamed live on Zoom for those who cannot attend in person.\nFood and refreshments will be served.\nSpeaker(s): Dr. John H Lau\,\nBldg: Bahen Centre for Information Technology\, 40 St George St\, Room BA1240\, Toronto\, Ontario\, Canada\, M5S 2E4\, Virtual: https://events.vtools.ieee.org/m/335514
URL:https://www.ieeetoronto.ca/event/ieee-eps-distinguished-lecture-chiplet-design-and-heterogeneous-integration-packaging/
LOCATION:Bldg: Bahen Centre for Information Technology\, 40 St George St\, Room BA1240\, Toronto\, Ontario\, Canada\, M5S 2E4\, Virtual: https://events.vtools.ieee.org/m/335514
CATEGORIES:Circuits & Devices
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