Circuits & Devices Chapter

Upcoming Events

In this lecture, the introduction, recent advances, and trends in chiplet design and heterogeneous integration packaging will be presented. Heterogeneous integration uses packaging technology to integrate dissimilar chips, photonic devices… (Read more)

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Past Events

2022

Power has become the key driving force in processor as well AI specific accelerator designs as the frequency scale-up is reaching saturation. In order to achieve low power system, circuit and technology co-design is essential. This talk focuses on related technology and important circuit techniques for nanoscale VLSI circuits… (Read more)
Video recording of this talk can be made available to attendees of the event. If you would like to request access to this file please send an email to toronto-07058@ieee.org.

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Since late 2000’s, SAR ADCs have become one of the most popular ADC architectures showing not only excellent energy efficiency but also competitive conversion speed owing to the digital-friendly compact structure and architectural evolution in deep submicron technologies… (Read more)
This event features representatives from prominent companies with offices in the GTA to give talks on active areas of innovation in the circuits & electronics industry. These sessions will help familiarize students with where companies are most actively focussing innovation efforts… (Read more)

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2021

The lecture is composed of two one-hour parts. In Part I a general overview of SSR/IFF is presented which includes a review of terms and definitions. From there, a historical timeline of SSR/IFF is summarized beginning with early implementations and ending with modern day systems… (Read more)
The integrated circuit (IC) technology has witnessed an exponential advancement in the last decades and has changed every aspect in our life. On the other hand, the analog IC design flow did not experience any major change since the introduction of Berkeley SPICE in the 1970s, posing significant challenges… (Read more)
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Products like Fitbit and the Apple Watch have brought to the public decades of foundational work on wearable technologies achieved by researchers in the IEEE CAS Society and related groups. Similarly, research into brain- and human-machine interface is starting to enter the public domain in applications… (Read more)
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Device scaling for sub-10 nm CMOS technology has introduced bulk/SOI FinFETs This talk will outline the self-heating (SH) in FinFETs and its characterization. Local self-heating can potentially affect device performance and exacerbate the effects of some reliability mechanisms… (Read more)
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The emergence of enhanced mobile broadband (eMBB) connectivity based on mmwave 5G generated huge interest in the entire telecommunication ecosystem. While mmwave allows huge bandwidth of channels to enable enhanced broadband, it also poses a lot of technical challenges in terms of coverage(Read more)
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Compute-in-memory (CIM) is a new computing paradigm that addresses the memory-wall problem in the deep learning inference engine. SRAM and resistive random access memory (RRAM) are identified as two promising embedded memories to store the weights of the deep neural network (DNN) models… (Read more)
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The chiplet interface allows multiple silicon dies of various technologies and complexities to communicate efficiently using larger parallel interconnects in a single package. The second layer of interconnect on the package (silicon or organic interposer) provides dense channels as well as low impedance power… (Read more)
In the last few years, electronics packaging has rightfully emerged from the shadows of CMOS scaling to make a significant impact in high performance and mobile appliance computing. The area of Flexible Hybrid Electronics (FHE) has also developed and is making a significant impact… (Read more)